The thin wafer market is projected to grow from USD 11.4 billion in 2022 to reach USD 20.6 billion by 2027; it is expected to grow at a Compound Annual Growth Rate (CAGR) of 12.5% from 2022 to 2027.
Rising adoption of MEMS
technology in portable health monitoring devices, reducing sizes of electronic
devices, growing smartphone and consumer electronics markets and high amount of
material saving is expected to fuel the growth of the thin wafer industry.
Thin wafer market for
CIS applications is expected to grow at a significant CAGR during the forecast
period.”
The thin wafer market
for CIS application is expected to grow at a significant CAGR during the
forecast period. CIS is used in mobile phones and other consumer electronic
devices. The miniaturization of these electronic devices generates the need for
thick and thin CMOS chips. Hence, to develop thin CIS chips, thin wafers are
used during their fabrication. This has led to an increased demand for CIS
thereby paving way for the growth of thin wafer market.
Wafer dicing equipment
to hold the largest market share of the thin wafer market during the forecast
period”
Wafer dicing dominated
the thin wafer market in 2021 and is expected to follow the trend during
forecast period. An increase in memory capacity and continuous package
miniaturization require ultra-thin wafer dicing. In recent years, there has
been an increasing adoption of RFID tags and SIP (system in package) for
smartphones and other compact electronic devices. This has resulted in the
rapid growth of finished semiconductor die with thickness less than or equal to
100 µm. This growing demand has made the processing of thin wafers an essential
competence for many integrated device manufacturers. The increasing demand for
high-speed dicing combined with superior breakage strength has paved way for an
increased demand for the wafer dicing equipment.
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Thin wafer market in
Asia Pacific estimated to grow at the fastest rate during the forecast period
Asia Pacific plays a
pivotal role in the development of the electrical and electronics industry. A
few of the leading thin wafer manufacturing companies such as Shin-Etsu
Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd.
(Taiwan), DISCO Corporation (Japan) are based in Asia Pacific. The high growth
of Asia Pacific can be attributed to the surging adoption of high-end consumer
electronics, such as wearables and smart home devices in China and Japan. The
global semiconductor market is expected to unveil substantial development in
the Asia Pacific region due to favorable economic conditions and increasing
demand for consumer electronics. As Asia Pacific has low labor cost most of the
thin wafers and wafer thinning equipment
are manufactured in Asia Pacific and are exported to various regions.
The significant growth toward manufacturing and the potential of China, Japan,
and Taiwan are largely contributing to this growth trend.
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