The high
density interconnect (HDI) market is expected to grow from USD 9.5 billion
in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A
few key factors driving the growth of this market are increasing adoption of
advanced electronics and safety measures in the automotive vertical and growing
demand for smart consumer electronics and wearable devices.
“The
HDI market for 10+ Layers HDI to grow at the highest CAGR during the forecast
period”
The HDI market for 10+ Layers HDI is expected
to grow at the highest CAGR during the forecast period. This growth can be
attributed to 10+ Layers HDIs being used in a wide range of devices, such
as high-reliability automotive products, high-density mobile devices, and IoT
modules. 10+ layers HDI offer benefits such as small size, lightweight
construction, and enhanced flexibility.
“The
HDI market for wearable electronics to grow at the highest CAGR during the
forecast period”
The HDI market for wearable devices is
expected to grow at the highest CAGR during the forecast period. HDI PCBs possess
technical characteristics of extremely high density routing interconnections
and make the high density of components possible. These attributes contribute
to the high performance and lightweight of HDI boards that make them ideal for
powering wearable devices.
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“APAC
is expected to account for the largest market share during the forecast period”
APAC
will likely account for the major share of the global HDI market in during the
forecast period. This growth can be attributed to the increasing application of
HDI in consumer electronics, automotive, and healthcare verticals in countries
such as China, India, and South Korea. It is also due to the extension of
telecommunications networks in China, Thailand, Malaysia, South Korea, India,
and other developing countries in APAC.
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