The flip
chip technology market is expected to reach USD 31.27 Billion by 2022, at a
CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and
future growth potential of the flip chip technology market across different
segments on the basis of bumping process, packaging technology, packaging type,
product, application, and region. Consumer electronics application is expected
to be the fastest-growing segment in the flip chip technology market during the
forecast period, followed by automotive application.
The
scope of this report covers the flip chip technology market by bumping process,
packaging technology, packaging type, product, application, and region. The
copper pillar process is expected to hold the largest market share of the
global market, and it is also expected to be the fastest-growing technology to
manufacture chips in various applications during the forecast period. The
maximum growth of Cu pillars is driven by the need of finer pitches, higher I/O
counts, lithography nodes below 28nm, emergence of 2.5D/3D packaging, and increased
current density, and thermal dissipation needs.
The
market in APAC is estimated to grow rapidly between 2016 and 2022. Majorly, the
demand for flip chip technology is coming from the consumer electronics sector
and particularly from smartphones and tablets. As a result, the presence of
major companies in this sector such as Samsung (South Korea), Sony (Japan), and
many other are driving the flip chip technology market in the APAC region.
Additionally, this region is home to three of the major players in flip chip
market ASE group (Taiwan), TSMC (Taiwan), and Samsung (South Korea).
The
major challenge for the adoption of flip chip technology is the high cost
associated with flip chip packaging solutions, which are generated from wafer
fabrication vendors, substrate vendors, and assembly/packaging subcontractors.
With the added costs of assembly/packaging, the flip chip package becomes a
cost-prohibitive option for the customers. The packaging and assembly houses
have taken steps toward providing cost-effective solutions by offering flip
chip packaging options on a standard leadframe (FCSOL), quad flat pack no leads
(QFN), and standard bis-maleimide triazine resin substrates
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Major
players in this market are Samsung (South Korea), Intel (U.S.), GlobalFoundries
(U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS
ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics
(Switzerland) among others. These players adopt various strategies such as
partnerships, agreements, mergers and acquisitions, and new product
developments to achieve growth in the global flip chip technology market. Amkor
Technology, which is a market leader in the flip chip technology, has entered
into a partnership with Electronics Industry Citizenship Coalition (EICC) to
design and develop several package layouts and technologies, including the
Package-on-Package (‘PoP’) platform with Through-Mold Via (‘TMV’) technology,
fusion quad, flip chip ball grid array (FCBGA), multi-chip modules (MCM) with a
silicon interposer placed between the module chips and substrate, copper pillar
bumping, and fine pitch copper pillar flip chip packaging technologies. The
company has merged with Toshiba’s Malaysian Semiconductor Packaging (Japan) to
develop a new research technology in advance semiconductor packaging.
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