The wired interface market
is expected to reach 8.78 billion units by 2023 from 6.51 billion units in
2018, at a CAGR of 6.2% between 2018 and 2023. The said market was valued at
USD 17.87 billion in 2018, and is expected to reach USD 34.72 billion by 2023,
at a CAGR of 14.2% between 2018 and 2023. Major factors driving the
growth of the market include increasing use of consumer devices such as
smartphone and increasing demand for wired interface due to its advantage of
high data and power transfer capacity over wireless technology.
PCs
and laptops are expected to hold the largest share of the wired interface
market throughout the forecast period. Most PCs and laptops are equipped with
USB, HDMI, DisplayPort, and Thunderport technologies. Demand for PC and laptop
is expected to decrease during the forecast period because of the increase in
the use of smartphones and tablets. Furthermore, because of the high price of
laptops, in developing economies, consumers are delaying buying new
PCs/laptops, thus extending the lifecycle of existing PCs/laptops.
The
USB Type C wired interface is expected to grow at the highest CAGR during the
forecast period. USB Type C wired interface is a two-way rotational 24-pin
connector, which is smaller in size and can be embedded with all possible
devices. Thus, they are currently being adopted in compact devices such as
smartphone, tablets and wearables.
The
wired interface market in North America is expected to register the highest
CAGR during the forecast period. North America is a hub for technological innovations
and an early adopter of new technologies. Factors such as presence of major
companies, increasing consumer spending, and growing popularity of advanced
devices are driving the market in North America. Asia Pacific
accounted for the largest share of the overall market in 2017, with China
being one of the major contributors in terms of market size.
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Major players in the wired interface market
include Molex, Inc. (The US), Amphenol Corporation (The US), Japan Aviation
Electronics Industry, Ltd. (Japan), TE Connectivity Ltd. (Switzerland),
STMicroelectronics N.V. (Switzerland), NXP Semiconductors N.V. (The
Netherlands), Microchip Technology Inc. (The US), Texas Instruments Inc. (The
US), Cypress Semiconductor Corp. (The US), Rohm Co., Ltd. (Japan), Hirose
Electric Co., Ltd. (Japan), ON Semiconductor Corporation (The US), Analog
Devices Inc. (The US), Diodes Inc. (The US), Murata Manufacturing Co. Ltd.
(Japan), Vishay Intertechnology, Inc. (The US), Silicon Laboratories Inc. (The
US), Maxim Integrated Products, Inc. (The US), CUI, Inc. (The US), and Yamaichi
Electronics Co.,Ltd. (Japan).
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