According
to the new market research report "Flip Chip Technology
Market by Wafer Bumping Process (CU Pillar,
Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA,
PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and
Geography - Global Forecast to 2022",
the flip chip technology market is expected to grow from USD 19.01 Billion in
2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The
flip chip technology market is driven by factors such as increasing demand for
miniaturization and high performance in electronic devices, and strong
penetration in consumer electronics sector.
3D IC packaging technology to register
the highest growth rate
On
the basis of packaging technology, the flip chip technology market is segmented
into 2D IC, 2.5D IC, and 3D IC packaging technology. With the semiconductor
technology moving towards integration of diverse chips, 2.5D IC packaging
technology and 3D IC packaging technology are becoming the mainstream trend in
obtaining the integration objectives. Owing to the growing demand for
increasing density, higher bandwidth, and lower power, design teams are
expected to adopt 3D ICs with TSVs, which promise ‘more than Moore’ integration
by packaging a great deal of functionality into small form factors, while
improving performance and reducing costs.
Applications in consumer electronics
held the largest market size and would also grow at the highest rate
Smartphones
& tablets are observed to have the highest adoption among all the consumer
electronic devices, owing to their small form factor and better performance
requirements to operate at a higher bandwidth, at a relatively lower cost. The
automotive market is expected to grow at a second-highest CAGR rate,
catapulting the flip chip technology market further.
The market in Asia-Pacific to grow at
the highest rate
The
APAC held a large share of the overall flip chip technology market in 2015;
moreover, the market in APAC is expected to grow at the highest CAGR between
2016 and 2022. Countries in Asia-Pacific are major manufacturing hubs and are
expected to provide ample opportunities for the growth of the flip chip
technology. The growing demand for high performance in smartphones and
automotive MCUs is driving the market in this region.
Major
players in this market are Intel (U.S.), TSMC (Taiwan), Samsung (South Korea),
and GlobalFoundries (U.S.), ASE group (Taiwan), Amkor Technology (U.S.), UMC
(Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and
STMicroelectronics (Switzerland) among others.
On
the basis of wafer bumping process, the flip chip technology market is
segmented into copper pillar, lead free, tin/lead eutectic solder, and gold
stud+ plated solder. The product segment consists of CPU, SoC, GPU, memory,
LED, CMOS image sensor, and RF, mixed signal, analog, and power IC. On the
basis of application, the market is segmented into consumer electronics,
telecommunications, automotive, industrial sector, medical devices, smart
technologies, and military and aerospace. The packaging type segment includes
FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, and FC CSP. The packaging technology in
flip chip has been segmented into 2D IC, 2.5D IC, and 3D IC. This global report
gives a detailed view of the market across the four regions, namely, Americas,
Europe, Asia-Pacific, and the Rest of the World which includes the Middle East
and Africa. The report profiles the 10 most promising players in the flip chip
technology market.
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