The report "Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary
Bonding & Debonding and Carrier-less/Taiko Process), Technology,
Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and
Geography - Global Forecast to 2027" The thin wafer market is projected to grow from USD 11.4
billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is
expected to grow at a CAGR of 12.5% from 2022 to 2027. Rise in the adoption of
MEMS technology in portable health monitoring devices coupled with reduction in
the sizes of electronic devices, growing smartphone and consumer electronics
markets as well a high amount of material saving is expected to fuel the growth
of the thin wafer market.
Thin wafer market for LED application expected to
witness the highest growth during the forecast period.
The LED application segment is likely to exhibit the
highest growth during the forecast period owing to its increasing demand across
the globe. Earlier, LEDs were developed through GaN; however, due to the high
cost involved in the development of LED through GaN, manufacturers shifted toward
thin silicon wafers. A thin wafer offers high conductivity and electrical
benefits for LED chips as well as inhibits the optimal utilization of LED
chips, which is not possible through GaN. These benefits of thin wafers are
expected to drive market growth.
300 mm wafers expected to grow at the highest CAGR
during the forecast period.
A high growth in the use of 300 mm wafers in
applications like LED on account of greater yield offered by these wafers is
propelling the growth of the thin wafer market across the world. It has become
highly imperative for LED manufacturers to achieve economies of scale and
improve profitability, which is offered by these wafers. These wafers offer
manufacturers the ability to produce a large number of devices in a single batch.
This is one of the reasons companies are developing semiconductor devices that
are composed of 300 mm wafers. Moreover the rise in the number of 300 mm wafer
fabrication facilities is expected to generate a significant rise in demand for
300 mm wafers.
Wafer dicing technology to dominate the market
during the forecast period.
Wafer dicing dominated the thin wafer market in 2021
and is expected to follow the trend during forecast period. The increasing
demand for high-speed dicing along with superior breakage strength is
contributing to the market growth. Additionally, the requirement for
smaller, high performing, and less costly device configuration for use in
applications such as memory devices, logic devices, power devices, and sensors
is expected to contribute toward the growth of the wafer dicing equipment
market during the forecast period.
Logic application to hold a significant share of the
thin wafer market during forecast period.
The demand for logic devices such as microprocessors
and digital signal processors is driven by growth in the implementation of
server and data center systems across various businesses and industries due to
the high penetration of affordable cloud computing solutions. In logic devices,
thinning technology is preferred to achieve high-speed processing and
reconfigurations. To ensure efficient thermal management and optimize
performance, thin wafers are increasingly being used in these devices, thereby
contributing to the growth of the thin wafer market for logic devices.s
Americas held significant share of thin wafer market
in 2021 and is expected to follow the trend by 2027
Americas is expected to account for a significant of
the thin wafer market during the forecast period. The growth of the market can
be attributed to the presence of key semiconductor device manufacturers and
their fabrication plants in the country. This region is home to a large number
of semiconductor companies. Other than extensive globalization, the entry of
global players into the region is one of the major reasons for the market
growth in the Americas. The growth of the thin wafer market in the region can
be attributed to the huge adoption of high-end smartphones, wearables, smart
home systems, and automotive communication systems. These devices use thin
wafers to minimize power losses and enable the designing of advanced
architecture with high system efficiency and greater power density.
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Key players in the thin wafer market include
Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers
Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec
(Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied
Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova
(Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom
technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK
Solar (China), UniversityWafer, Inc. (US) are among a few emerging companies in
the thin wafer market.
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