The global thin wafer market is estimated to be USD 10.8 billion by 2025 from USD 7.6 billion in 2020, growing at a CAGR of 7.2% between 2020 to 2025. The growth of the thin wafer market can be attributed to factors such rising adoption of MEMS technology in portable health monitoring devices, growing smartphone and consumer electronics markets, reducing sizes of electronic devices, and high amount of material saving.
Who are the winners in the global thin wafer market?
Companies such as Shin-Etsu Chemical Co., Ltd.
(Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic
(Germany), and SK Siltron (South Korea) fall under the winner’s category. These
companies cater to the requirements of their customers by providing efficient
thin wafers with a presence in majority of countries. Moreover, these companies
have a strong and reliable distribution network which gives them an edge over
other industry players.
What are the opportunities for the existing players
and for those who are planning to enter various stages of the thin wafer value
chain?
There are various opportunities for the existing
players to enter the value chain of the thin wafer industry. Some of these
include the growing use of thin wafers in automotive applications for the
safety and in-vehicle communication systems, increased requirement for thin
wafers in portable medical devices, and the growing implementation of different
diameters of thin wafers in discrete semiconductor devices.
What is the Covid-19 impact on thin wafer market?
The shutdown of manufacturing facilities globally
combined with strict restrictions over social movement in various COVID-19
affected countries impacted the operations of thin wafer manufacturing
facilities. Leading thin wafer providers, such as GlobalWafers Co., Ltd.
(Taiwan) and Siltronic (Germany), have incurred significant losses owing to the
pandemic. Both companies have reported a decline of approximately 10% and 6%
respectively in their half-year revenue as compared to the previous year. Also,
devices such as MEMS, CIS, memory, RF devices, LEDs, interposers, and logic
have experienced a decline in demand from end-user industries such as consumer
electronics, automotive, industrial, and medical. This has resulted in a
decline in the demand for thin wafers.
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What are some of the technological advancements in
the market?
Silicon Carbide (SiC) is evolving at a rapid space.
SiC wafers are largely preferred by semiconductor device manufacturers and
fabrication facilities as they offer several advantages over traditional
silicon substrates. One of the major advantages of this substrate is its
hardness. This substrate is increasingly used for thin wafers to minimize the
impact of pressure or stress. Also, SiC has a low coefficient for thermal
expansion, which means its shape does not gets altered when subjected to
heating or cooling. It can operate on temperatures as high as 1600 °C, which
makes it suitable for high-temperature applications. .
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