The spin on carbon market is projected to grow from USD 199 million in 2023 to USD 747 million by 2028, registering a CAGR of 30.2% during the forecast period. The rapid technological advancements in semiconductor manufacturing, the complexity of integrated circuits, and the development of advanced packaging solutions are expected to propel the spin on carbon in the semiconductor market in the next five years. However, competitive substitution materials will likely pose challenges for industry players.
Driver: Expansion of EUV (Extreme Ultraviolet)
Lithography in Memory manufacturing
With the growing
adoption of data-driven technologies, artificial intelligence, and various
high-performance computing applications, demand is increasing for more powerful
and efficient chips. Prominent companies such as Intel Corporation, Advanced
Micro Devices, Inc., and Taiwan Semiconductor Manufacturing Company Limited
have invested substantially in EUV lithography equipment. Spin-on-carbon (SOC)
hard mask is useful for the multilayer lithography process because of its high
etch resistance, low cost of ownership, low defectivity, high alignment
accuracy, good gap filling and planarization for topography. The increasing
adoption and development of spin on carbon with EUV lithography process by
market players are also driving the market growth.
Restraint: Availability
of substitute competitive materials
In the field of
semiconductor manufacturing, several materials can serve as alternatives or
substitutes for spin-on carbon materials that possess comparable or improved
properties and performance characteristics. These key substitutes include
spin-on metal, spin-on glass, dielectric polymers and coatings, organic
polymers, and others. Inorganic hardmasks, such as silicon nitride (SiN) and
silicon oxide (SiO2), offer higher etch resistance and thermal stability than
SOC. This makes them more suitable for use in advanced semiconductor
applications, such as extreme ultraviolet (EUV) lithography.
Opportunities: Continued
miniaturization of electronic devices
The growing trend of
miniaturization in passive electronic components is leading to their
integration into consumer electronics like smartphones, cameras, and speakers.
Continued miniaturization of electronic devices indeed creates significant
opportunities for the spin on the carbon market. As the demand for smaller,
faster, and more energy-efficient electronic devices continues to grow, the
role of spin-on carbon materials becomes increasingly critical in enabling the
development of advanced semiconductor technologies.
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Challenges: Technical
challenges associated with the SOC materials
As the development of
new SOC materials and processing methods progresses, the problem of spin-on
carbon breakdown at high temperatures is likely to be solved. This will make
SOC a more viable option for a wider range of applications.
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